Loadlock designs and methods for using same

ABSTRACT

Provided are apparatuses and methods disclosed for wafer processing. Specific embodiments include dual wafer handling systems that transfer wafers from storage cassettes to processing modules and back and aspects thereof. Stacked independent loadlocks that allow venting and pumping operations to work in parallel and may be optimized for particle reduction are provided. Also provided are annular designs for radial top down flow during loadlock vent and pumpdown.

BACKGROUND

Different types of tools are used to perform hundreds of processingoperations during semiconductor device fabrication. Most of theseoperations are performed in vacuum chambers at very low pressure. Wafersare introduced to the process chambers with wafer handling systems thatare mechanically coupled to the process chambers. The wafer handlingsystems transfer wafers from the factory floor to the process chamber.These systems include loadlocks to bring the wafers from atmosphericconditions to very low pressure conditions and back, and robots totransfer the wafers to various positions. Throughput—the number ofwafers that is processed in a period of time—is affected by the processtime, the number of wafers that are processed at a time, as well astiming of the steps to introduce the wafers into the vacuum processchambers. What are needed are improved methods and apparatuses ofincreasing throughput.

SUMMARY

The apparatuses and methods disclosed herein pertain to parallelprocessing of wafers. Specific embodiments include dual wafer handlingsystems that transfer wafers from storage cassettes to processingmodules and back and aspects thereof. Stacked independent loadlocks thatallow venting and pumping operations to work in parallel and may beoptimized for particle reduction are provided. Also provided are annulardesigns for radial top down flow during loadlock vent and pumpdown.

One aspect of the invention relates to a stacked loadlock assembly fortransferring substrates between an atmospheric environment and a vacuumtransfer module. The assembly includes a lower loadlock having one ormore chambers, each chamber having a substrate support and a sealabledoor selectively openable for transferring a substrate between thechamber and a transfer module robot and an upper loadlock disposed overthe lower loadlock, the upper loadlock having one or more chambers, eachchamber having a substrate support and a sealable door selectivelyopenable for transferring a wafer between the chamber and a transfermodule robot. The upper loadlock is isolated from the lower loadlock andthe vertical distance between the upper and lower substrate transferplanes is no more than 100 mm, and in certain embodiments, no more than70 mm. In certain embodiments, the height of the stacked loadlockassembly is no more than 10″ as measured from the bottom of the lowerloadlock chambers to the top of the upper loadlock chamber. Chambervolume typically ranges from about 3 to about 20 L. In certainembodiments, each loadlock of the stacked loadlock assembly has dualsubstrate chambers.

In certain embodiments, at least one loadlock of the stacked loadlockassembly in configured for radial venting and/or radial pumpdown. Incertain embodiments, the upper loadlock is configured for radialpumpdown and the lower loadlock is configured for radial venting. Alsoin certain embodiments, each loadlock is configured for at least one of:radial pumping and radial venting. In certain embodiments, the loadlockassembly does not have central pumping or venting ports.

Another aspect of the invention relates to a stacked loadlock assemblyfor transferring substrates from a first environment to a secondenvironment, the assembly including a upper loadlock comprising one ormore substrate chambers; a lower loadlocks comprising one or moresubstrate chambers, each upper loadlock substrate chamber disposed overa lower loadlock substrate chamber; and one or more center plates forisolating each lower loadlock substrate chamber from the overlying upperloadlock chamber, wherein each center plate defines the floor of theupper loadlock chamber and the ceiling of the lower loadlock chamber.

In certain embodiments, each center plate annular recesses, one annularrecess that at least partially defines a flow path for pumping gas outof the upper loadlock chamber and another annular recess that at leastpartially defines a flow path for venting gas into the lower loadlockchamber.

In certain embodiments, the stacked loadlock assembly has at least oneupper aperature for transferring substrates in and/or out of the upperloadlock and at least one lower aperature for transferring substrates inand/or out of the lower loadlock. The at least one upper aperature isseparated from the at least one lower aperature by a vertical distanceof no more than about 100 mm. The height of the assembly is no more than10″ chamber height in certain embodiments. Also, in certainemboidiments, the stacked loadlock assembly has one or more upperloadlock lids for covering the one or more upper loadlock chambers,wherein each lid has an annular recess that at least partially defines aflow path for venting gas into the lower loadlock chamber.

Another aspect of the invention relates to a method of transferringsubstrates between an atmospheric environment and a vacuum environmentusing a loadlock apparatus, which according to various embodiments mayhave one or more of the following features: a lower loadlock having oneor more chambers, each chamber having a substrate support and a sealabledoor selectively openable for transferring a substrate between thechamber and a transfer module robot; an upper loadlock disposed over thelower loadlock, the upper loadlock having one or more chambers, eachchamber having a substrate support and a sealable door selectivelyopenable for transferring a wafer between the chamber and a transfermodule robot. The method includes transferring one or more substratesbetween the atmospheric environment and the one or more upper loadlockchambers on an upper loadlock substrate horizontal transfer plane;transferring one or more substrates between the vacuum environment andthe one or more loadlock chambers on a lower loadlock substratehorizontal transfer plane; wherein the upper loadlock is isolated fromthe lower loadlock and the vertical distance between the upper and lowersubstrate horizontal transfer planes is no more than 100 mm.

Another aspect of the invention relates to a loadlock apparatus forradially venting a loadlock chamber containing a wafer. The apparatusincludes a wafer support in said loadlock chamber, a side inlet port,said side inlet port opening into an annular chamber located above saidloadlock chamber, said annular chamber connected to an annular steppednarrow channel for directing flow parallel to a wafer on the support.According to various embodiments, the loadlock apparatus may include oneor more of the following features: a loadlock housing defining the sideinlet port and an upper plate defining the ceiling of the loadlockchamber and a loadlock housing, wherein the annular channel is definedby the loadlock housing and a recessed portion of the upper plate. Incertain embodiments, annular sections of the upper plate and loadlockhousing are stepped, with the outer diameter of the stepped section ofthe plate less than the inner diameter of the stepped section of theloadlock housing to thereby define the annular stepped channel. Thewidth of the annular stepped narrow channel is between about 0.005 to0.050 inches in certain embodiments. The stepped channel may include anouter section parallel to a wafer surface, a perpendicular section, andan inner parallel section. In certain embodiments, the dimensions of arectangular cross-section of the annular chamber range from about0.25-1.5 inches. Also, in certain embodiments, the side inlet port, theannular chamber and annular stepped narrow channel define a flow pathfor gases vented into the loadlock chamber. The annular stepped narrowchannel chokes the vent gas flow in certain embodiments.

Yet another aspect of the invention, relates to loadlock apparatus forradially pumping down a loadlock chamber containing a wafer. Theapparatus includes a wafer support in said loadlock chamber, a sideoutlet port opening into an annular chamber, the annular chamber locatedbelow said wafer support; a narrow annular channel connecting theloadlock chamber to the annular chamber for directing flow into theannular chamber. The inner diameter of the annular channel is greaterthan the wafer support diameter. The loadlock apparatus may also includea loadlock housing defining the side outlet port. In certainembodiments, the apparatus includes a lower plate defining the floor ofthe loadlock chamber and a loadlock housing, wherein the annular channelis defined by the loadlock housing and a recessed portion of the lowerplate. The apparatus may also include a loadlock housing, wherein theouter diameter of a section of the plate is less than the inner diameterof a section of the loadlock housing to thereby define the annularchannel. In certain embodiments the width of the narrow annular channelis between about 0.005 to 0.050 inches and the dimensions of arectangular cross-section of the annular chamber range from about0.25-1.5 inches.

Yet another aspect of the invention relates to a stacked loadlockapparatus that includes a lower loadlock chamber having a wafer supportin said upper loadlock chamber, a side inlet port, said side inlet portopening into an upper annular chamber located above said upper loadlockchamber, said annular chamber connected to an annular stepped narrowchannel for directing flow parallel to a wafer on the support; and anupper loadlock chamber comprising a wafer support in said upper loadlockchamber, a side outlet port opening into an annular chamber, an annularchamber located below said wafer support; a narrow annular channelconnecting the loadlock chamber to the annular chamber for directingflow into the annular chamber, the inner diameter of the annular channelgreater than the wafer support diameter.

A further aspect of the invention relates to a method of venting aloadlock chamber containing a wafer, said loadlock chamber comprising: awafer support in said loadlock chamber, a side inlet port, said sideinlet port opening into an annular chamber located above said loadlockchamber, said annular chamber connected to an annular stepped narrowchannel for directing flow parallel to a wafer on the support. Themethod may include inleting gas through the annular chamber, such thatthe gas flows into the annular stepped narrow channel to thereby directa radial flow of the gas into the loadlock chamber parallel to thewafer.

A method of pumping down a loadlock chamber containing a wafer, saidloadlock chamber comprising: a wafer support in said loadlock chamber, aside outlet port opening into an annular chamber, the annular chamberlocated below said wafer support; a narrow annular channel connectingthe loadlock chamber to the annular chamber for directing flow into theannular chamber. The method may include radially pumping gas outwardfrom the center of the wafer by pumping gas through the side outlet portsuch that the gas is choked through the annular channel into the annularchamber.

These and other aspects and advantages of the invention are described inthe detailed description which follows.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic of an exterior of a dual wafer handling apparatusand components thereof according to various embodiments.

FIGS. 2 a and 2 b are schematics of a dual wafer handling apparatus thatshow internal views of the atmospheric environment and the transfermodule according to various embodiments.

FIGS. 3 a-e are graphical representations showing top views of a dualwafer transport apparatus performing certain operations in dual wafertransport of a pair of wafers from a storage cassette to a wafertransfer module and back according to certain embodiments.

FIG. 3 f shows an example of a sequence of movements a pair of wafersmay undergo in a process module according to certain embodiments of themethods and apparatuses described herein.

FIG. 3 g shows a schematic of two arm dual end effector transfer modulerobot with one dual end effector arm in an extended position and theother dual end effector arm in a retracted position.

FIGS. 4 a and 4 b are schematics of a stacked loadlock according tocertain embodiments.

FIGS. 5 a and 5 b are schematics of cross-sectional and exploded viewsof a stacked loadlock according to certain embodiments.

FIGS. 6 a and 6 b are schematics illustrating the pump and vent designsfor an upper loadlock according to certain embodiments.

FIGS. 7 a and 7 b are schematics illustrating the pump and vent designsfor a lower loadlock according to certain embodiments.

DETAILED DESCRIPTION

Overview

FIG. 1 shows an exterior of dual wafer handling apparatus and componentsthereof according to aspects of the invention. The apparatus shown inFIG. 1 may be used to transfer wafers from atmospheric conditions (e.g.,to and from a storage unit) to one or more processing chambers (e.g.,PECVD chambers) and back again. The apparatus shown in FIG. 1 has threemain components: an atmospheric environment 102, loadlocks 104 and atransfer module 106. Storage units (e.g., Front Opening Unified Pods orFOUPs) and processing chambers are not shown in the figure. Atmosphericenvironment 102 is typically at atmospheric pressure and can interactwith FOUPs and/or parts of the external facility. Transfer module 106 istypically at sub-atmospheric pressure and can be in communication withthe loadlocks and various processing chambers which are often run atvacuum or low pressure. Wafers are placed in loadlocks 104 for pump-downor vent operations when transitioning between atmospheric andsub-atmospheric environments.

The atmospheric environment 102 (also referred to as a‘mini-environment’) contains an atmospheric robot (not shown) thattransfers wafers to and from FOUPs and loadlocks 104. Pod loaders 108receive and support FOUPs so that they may be accessed by theatmospheric robot. The atmospheric environment 102 typically contains anoverhead fan filter unit, e.g., a HEPA filter unit, to preventcontaminants from entering the atmospheric environment. The air inlet110 for the fan filter unit is shown in FIG. 1. The lower boundary ofthe atmospheric or mini-environment may be a false floor, such as thatdepicted in FIG. 1 at 112.

Loadlocks 104 receive inbound (unprocessed) wafers from the atmosphericenvironment 102 to be transferred to the process chambers, and outbound(processed) wafers from the transfer module 106 to be transferred backto the FOUPs. A loadlock may be bidirectional (holding inbound andoutbound wafers) or unidirectional (holding only inbound or outboundwafers). In certain embodiments, the loadlocks are unidirectional.Inbound wafers are also referred to herein as incoming or unprocessedwafers; outbound wafers are also referred to herein as outgoing orprocessed wafers.

In FIG. 1, there are two independent loadlocks: an upper loadlockstacked on top of a lower loadlock, each having two connected chambers.In certain embodiments, the upper loadlock is an inbound loadlock andthe lower loadlock is an outbound loadlock. Plates 114 are lids of theinbound loadlock, each plate covering one of the two connected chambers.Loadlock vacuum pumps 116 are used to pump down the loadlocks asnecessary during operation.

Atmospheric valve doors 118 provide access to the loadlocks from theatmospheric environment 102. In the embodiment shown, a four door slitvalve externally mounted to the mini-environment is used, though anytype of doors or valves including gate valves, sliding doors, rotationaldoors, etc., may be used.

The transfer module is configured to be attached to one or more processmodules (e.g., single or multi-station PECVD chambers, UV cure chambers,etc.). A process module may be attached to the transfer module 106 atmultiple interface locations/sides of the transfer module. Slit valves122 provide access from the transfer module to the process modules. Anyappropriate valve or door system may be used. In FIG. 1, there are twovalves per side—allowing two wafers to be transferred between a loadlockand a process module (e.g., between two chambers of a loadlock and twoadjacent stations of a process module) or between two process modules.Transfer module lift assembly 120 is used to raise and lower the cover128 of the transfer module. In FIG. 1, cover 128 is down (i.e., theinterior of the transfer module is not shown in the figure). A vacuumtransfer robot is located in the interior of the transfer module totransfer wafers between the loadlocks and the process modules or fromprocess module to process module.

The transfer module 106 is maintained at sub-atmospheric pressure, andis sometimes referred to herein as a vacuum transfer module. Transfermodule pressure is typically between 760 torr-1 militorr, though incertain embodiments the tool may be used for even lower pressureregimes. Once an inbound wafer is in place in the loadlock, the loadlockvacuum pumps 116 are used to pump down the loadlock to a sub-atmosphericpressure so that the wafer may be subsequently transferred to the vacuumtransfer module. Loadlock slit valves 130 provide access to theloadlocks from the transfer module 106. Transfer module vacuum pump 124,along with a gas mass flow controller (MFC), a throttle valve and amanometer, is used to obtain and maintain the desired pressure of thetransfer module. In general, on-tool or off-tool vacuum pumps may beused for the transfer module. As is known in the art, various methods ofcontrolling pressure in the transfer module exist. In one example, a MFCprovides a constant flow of N₂ gas into the transfer chamber. Themanometer provides feedback as to the pressure of the transfer modulechamber. The vacuum pump removes a constant volume of gas per unit timeas measured in cubic feet per minute. The throttle valve activelymaintains a pressure set point through the use of a closed loop controlsystem. The throttle valve reads the manometer's pressure feedback, andbased on the commands from the valve's control system, adjusts theopening of the effective orifice to the vacuum pump.

An access panel 126 provides access to an electronics bay that containsa control system to control the wafer handling operations, includingrobot movements, pressure, timing, etc. The control system may alsocontrol some or all operations of processes performed in the processmodule. The controllers, switches, and other related electrical hardwarecan be located elsewhere according to various embodiments.

FIGS. 2 a and 2 b are additional schematics of a dual wafer handlingapparatus that show internal views of the atmospheric environment 102and transfer module 106. The apparatus shown in FIGS. 2 a and 2 b issubstantially that shown in FIG. 1, except that the shape of thetransfer module of the apparatus in FIGS. 2 a and 2 b is a trapezoid toallow a larger access 238 area to service the transfer module. Thetransfer module lift assembly and lid, and a portion of the atmosphericenvironment casing are not shown in FIG. 2 a.

The atmospheric environment or mini-environment 102 contains anatmospheric robot 232. The transfer module 106 contains a vacuum robot236. In the embodiment depicted in FIG. 2 a, the atmospheric robot 232has one arm, with two articulated wrists, each of which has a paddle orother end effector capable of carrying a wafer. Vacuum transfer robot236 has two arms, each with two paddles capable of carrying a wafer. Theatmospheric robot is capable of handling two wafers simultaneously andthe vacuum robot can simultaneously carry up to four wafers. (Theapparatus and methods described herein are not limited to theseparticular robot designs, though generally each of the robots is capableof simultaneously handling and/or transferring, and/or exchanging atleast two wafers.)

FIG. 2 a also provides a partial view of a pipe 244, also referred tothe loadlock pump foreline that leads from a manifold to the vacuumpumps 116. Dual vacuum pumps 116 work in tandem and are used to pumpdownboth loadlocks. According to various embodiments, the dual pumps mayfunction as a single pump resource or could be dedicated to a specificloadlock for parallel pump downs. FIG. 2 b shows a schematic of theapparatus shown in FIG. 2 a from the opposite side. The transfer modulelift assembly 120 and the transfer module lid 128 are shown in anupright position.

FIGS. 3 a-f are graphical representations showing certain operations indual wafer transport of a pair of wafers from FOUPs to the wafertransfer module and back. FIG. 3 a shows an apparatus with transfermodule 106, upper (inbound) loadlock 104 a, lower (outbound) loadlock104 b and atmospheric environment 102. Also shown are process modules330 a and 330 b. At this point, prior to their entry into atmosphericenvironment 102, wafers are located in e.g., FOUPs 334, which interfacewith the atmospheric environment 102. The atmospheric environment 102contains an atmospheric robot 332; the transfer module 106 contains avacuum robot 336.

As indicated above, the apparatus is capable of parallel transport andprocessing of two wafers. Both the atmospheric and transfer modulevacuum robots are capable of simultaneous handling at least two wafers.

Atmospheric robot 332 has one arm, with two articulated wrists, each ofwhich has gripper or blade capable of carrying a wafer. Vacuum transferrobot 336 has two arms, each with two blades or grippers capable ofcarrying a wafer.

The atmospheric robot takes two wafers from FOUPs. (The movement of arobot to take a wafer from a location such as a FOUP, loadlock orprocessing station is sometimes referred to herein as a “pick” move,while the placement of a wafer to a location by the robot is sometimesreferred to herein as a “place” move. These moves are also referred toherein as “get” and “put” moves, respectively.) Depending on the robotand the arrangement of the FOUPs or other wafer storage, the two wafersmay be taken simultaneously or one after another. In the embodimentdepicted in FIG. 3 a, for example, the atmospheric robot has one armwith two articulated wrists and is capable of simultaneous transfer oftwo stacked wafers, e.g., simultaneous picks of two stacked wafers froma FOUP. FIG. 3 b shows the atmospheric robot 332 with two wafers 335′and 335″ during transfer from the FOUP the upper loadlock 104 a. Theatmospheric robot then places the wafers into the upper loadlock 104 afor depressurization. This is shown in FIG. 3 c. One wafer is in eachchamber. Once the wafers are placed in the upper loadlock, theatmospheric doors 118 a of the upper loadlock close and the loadlock ispumped down. When the desired pressure is reached, the upper loadlockdoors 120 a on the transfer module side are open and transfer modulerobot 106 picks the wafers from the upper loadlock. FIG. 3 d showstransfer module robot 106 with wafers 335′ and 335″. The transfer modulerobot depicted in FIGS. 3 a-e has two arms, each with two end effectorsand is capable of holding four wafers simultaneously. In the embodimentshown, the upper loadlock does not have passive wafer centering, nor arethere independent z-drives in the loadlock for each of the wafers. Incertain embodiments, the vacuum robot picks the wafer simultaneously andcannot selectively pick one wafer if two wafers are present in theincoming loadlock. However, depending on the robot and the system, thetransfer module robot may pick each wafer simultaneously orconsecutively. Also depending on the robot and the system, the robot mayuse one arm with two end effectors to pick both wafers, or each wafermay be picked by a different arm. After picking the unprocessed wafersfrom the inbound loadlock, the transfer module robot transfers thewafers to a processing module, i.e., either process module 330 a orprocess module 330 b, by rotating and placing the wafers in the processmodule. Although not depicted in FIGS. 3 a-e, there may also be a thirdprocessing module connected to the transfer module. The wafers thenundergo processing in the process module. FIG. 3 f shows an example of asequence of movements the wafers may undergo in a process module 330 a.First, wafer 335′ is placed in station 338 of processing module 330 aand wafer 335″ is placed in station 340 of processing module 330 a. Thewafers then undergo processing at these stations. Wafer 335″ moves fromstation 340 to station 344 and wafer 335′ from station 338 to station342′ for further processing. The wafers are then returned to theiroriginal stations to be picked by the transfer module robot for transferto the outbound loadlock or to process module 330 b for furtherprocessing. For clarity, the stations are depicted as ‘empty’ in thefigure when not occupied by wafers 335′ and 335″, in operation allstations are typically filled by wafers. The sequence illustrated inFIG. 3 f is just an example of a possible sequence that may be employedwith the apparatuses described herein. The transfer module robot picksboth wafers up for simultaneous transfer to the loadlock. The pick movesmay occur simultaneously or consecutively. The robot then rotates toplace the processed wafers in the loadlock. Again, these moves may occursimultaneously or consecutively according to various embodiments. FIG. 3e shows the now processed wafers 335′ and 335″ placed in the outbound(lower) loadlock 104 b via lower loadlock doors 120 b. After beingplaced there, all loadlock valves or doors are shut and the outboundloadlock is vented (pressurized) to atmospheric pressure. The wafers mayalso be cooled here. The atmospheric doors 118 b of the outboundloadlock are then opened, and the atmospheric robot picks up theprocessed wafers and transfers them to the appropriate place in theFOUP.

It should be noted that the dual wafer processing apparatuses withmultiple process chambers and methods discussed herein can be used forparallel or sequential processing. In a parallel processing scheme, aset of wafers is processed in one process module and then returned tothe FOUP, while other set(s) of wafers are processed in parallel inother process module(s). In a sequential processing scheme, a set ofwafers is processed in one process module, and then transferred toanother process module for further processing prior to being returned toatmospheric conditions. Mixed parallel/sequential sequences are alsopossible, e.g., in which two process modules (PM1 and PM2) are used forparallel processing and then all wafers from these process modules aretransferred to a third process module (PM3) for further processing.Likewise a first process module may process all wafers, which are thensent to either a second or third module for parallel processing.

Unidirectional Flow

In certain embodiments, the loadlocks are used in unidirectionaloperation mode. An example of inbound and outbound loadlocks,atmospheric robot and transfer module robot moves in a unidirectionalflow scheme is given below in Table 1:

TABLE 1 Robot and Loadlocks Moves in Unidirectional Flow Operation ATMRobot Incoming LL (Upper) Outgoing LL (Lower) TM Robot FOUP Pick (1)Vent (Empty) TM Robot Lower LL Place (arm 2) Upper LL Place (2) ATMRobot (2) Vent/Cool (Wafers) PM Pick (arm 2) Lower LL Pick Pumpdown(Wafers) (3) ATM Robot PM Place (arm 1) FOUP Place TM Robot (4) Pumpdown(Empty) Upper LL Pick (arm 1) (4) FOUP Pick Vent (Empty) TM Robot LowerLL Place (arm 2) Upper LL Place ATM Robot Vent/Cool (Wafers) PM Pick(arm 2) (1′) Lower LL Pick Pumpdown (Wafers) ATM Robot PM Place (arm 1)(5) FOUP Place TM Robot Pumpdown (Empty) Upper LL Pick (arm 1) FOUP PickVent (Empty) TM Robot Lower LL Place (arm 2) (2′) Upper LL Place ATMRobot Vent/Cool (Wafers) (3′) PM Pick (arm 2) Lower LL Pick (4′)Pumpdown (Wafers) ATM Robot (4′) PM Place (arm 1) FOUP Place (5′) TMRobot Pumpdown (Empty) Upper LL Pick (arm 1)

Table 1 presents an example of a sequence of unidirectional operationalmode in which the transfer module robot hand-off sequence is processmodule (wafer exchange)

outgoing loadlock (place processed wafers)

incoming loadlock (pick unprocessed wafers). This is an example of onepossible sequence—others may be used with the dual wafer handlingapparatuses described herein. In a specific example, the transfer modulerobot-handoff sequence is process module (wafer exchange)

incoming loadlock (pick unprocessed wafers)

outgoing loadlock (place processed wafers).

Rows can be read as roughly simultaneously occurring or overlappingoperations. Columns show the sequence of operations the robot orloadlock performs. Of course, in any system, these operations may notoverlap exactly and one or more of the modules may be idle or begin orend later. Further, it should be noted that certain operations are notshown. The rotational and translational moves the robots must perform toreach the pods, loadlocks and process modules are not shown. Thedescriptions ‘TM Robot’ and ‘ATM Robot’ can refer to the moves theloadlocks undergo—opening and closing the appropriate doors—as well asadmitting the robot end effectors to pick or place the wafers.

The path of a pair of unprocessed wafers going from a FOUP to a processmodule is traced in the Table in steps 1-5:

1—ATM Robot FOUP Pick

2—ATM Robot Upper Loadlock Place

3—Upper LL Pumpdown (see FIG. 3 c)

4—TM Robot Pick

5—TM Robot Process Module Place

The path of a pair of processed wafers going from a process module to aFOUP is traced in the Table in steps 1′-5′:

1′—TM Robot Process Module Pick

2′—TM Robot Lower LL Place

3′—Lower LL Vent/Cool (see FIG. 3 e)

4′—ATM Robot Lower LL Pick

5′—ATM Robot FOUP Place

As can be seen from the Table 1, once outgoing wafers are handed off toan atmospheric robot, for example, the loadlock can then be pumpeddown—it does not have to wait for the atmospheric robot to complete itsmoves before pumping down. This is distinguished from bidirectionaloperation in which a loadlock is idle while the atmospheric robot placesthe processed wafers in a FOUP or other cassette and gets twounprocessed wafers from a cassette for placement into the loadlock.Various robot and loadlock moves according to certain embodiments aredescribed below.

Incoming LL

Pumpdown: Pressure in the upper loadlock is lowered from atmospheric toa predetermined subatmospheric pressure. As described below withreference to FIGS. 6 a and b, the loadlock is pumped down by pulling gasthrough a narrow gap around the pedestal. The gap is pumped into alarger cross section ring below the pedestal and is then pumped out fromthe side. This keeps the flow outward (radial flow from the wafercenter) and downward from the wafer—to avoid drawing any particles up tothe wafer. This pumpdown operation is rapid.

Vent: Vent the upper loadlock from a subatmospheric pressure toatmospheric. No wafer is present. The upper loadlock may be ventedradially as described below with reference to FIG. 6 a. Like the pumpdown operation, the vent operation is fairly rapid.

Examples of Timing of Incoming LL Moves (Secs)

Open/Close VAT Valve (Valve to Atmospheric environment): 0.5

Open/Close slit valve (valve to transfer module): 0.5

Verify slit valve closed, vent, verify at atmosphere: several seconds

Verify VAT door closed, pumpdown and transfer module pressure match:several seconds

Outgoing LL

Vent/Cool: Vent the lower loadlock from a subatmospheric pressure toatmospheric pressure. Venting is done by flowing gases such as heliumand/or nitrogen into the chamber. The helium enters through an annulargap at an 8 inch diameter above the wafer. Flow is top-down and radiallyoutward over the wafer to avoid drawing particles up to the wafer. Thewafers enter the lower loadlock needing to be cooled from processing. Inone embodiment, helium is first vented into the chamber as a heattransfer gas, to an intermediate pressure. Gas flow is then stoppedwhile the wafer cools. Nitrogen is then flowed to get the pressure up toatmospheric.

Pumpdown: Pump the lower loadlock from atmospheric to a pre-determinedsubatmospheric pressure. The chambers are empty.

Examples of Timing of Outgoing LL Moves (Secs)

Open/Close VAT Valve (valve to atmospheric environment): 0.5

Open/Close slit valve (valve to transfer module): 0.5

Verify slit valve closed, He vent, verify at atmosphere: several seconds

Verify VAT door closed, pumpdown and transfer module pressure match:several seconds

ATM Robot

FOUP Pick: The atmospheric robot picks two stacked unprocessed wafersfrom a FOUP or other cassette. In one embodiment, the end effectors arestacked on top of the other and pick the stacked wafers simultaneously.After picking the wafers, the end effectors are rotated with respect toeach other, and the arm is rotated to place the wafers in the upperloadlock (see FIG. 3 b, which shows a single arm dual end effector robotholding two wafers ready to place them into the upper loadlock).

Upper LL Place: The atmospheric robot places the wafers into the upperloadlock chambers. In certain embodiments, first one end effector isextended into a chamber of the upper loadlock and lowers the wafer ontothe shelf. The end effector is then retracted from the loadlock and thesecond end effector is extended into the other chamber of the upperloadlock and lowers the wafer onto the shelf. The robot thus places theleft and right wafers consecutively, in either order.

Lower LL Pick: The atmospheric robot picks the wafers from the lowerloadlock chambers. In certain embodiments, first one end effector isextended into a chamber of the lower loadlock and picks the wafer fromthe pedestal. The end effector is then retracted from the loadlock andthe second end effector is extended into the other chamber of the lowerloadlock and picks the wafer from the pedestal. The robot thus picks theleft and right wafers consecutively, in either order. In certainembodiments, the robot uses information about the placement of eachwafer in the lower loadlock to correct wafer position during the pickmove. The atmospheric robot arm is then rotated to place the wafers inthe FOUP.

FOUP Place: The atmospheric robot places the wafers into stackedpositions in a FOUP. In one embodiment, both wafers are placedsimultaneously.

Examples of Timing of ATM Robot Moves (Secs)

Goto outgoing LL from incoming LL: 0.5

Get wafers from outgoing LL: 5.9

Goto cassette from outgoing LL: 1

Put wafers into cassette: 3

Retract and move in Z-direction in prep for “get” from cassette: 0.3

Get wafers from cassette: 2.5

Goto incoming LL from cassette: 1.3

Put wafers into incoming LL: 6.5

Transfer Module Robot

Upper LL Pick: The transfer module robot extends one dual end effectorarm into the upper loadlock and lifts the wafers from the shelves ontothe end effectors. In certain embodiments, as one arm is extended intothe loadlock, the other arm moves into a retracted position. FIG. 3 gshows a dual arm dual end effector robot with one arm extended (e.g.,into a loadlock or process module for a pick or place move) and one armretracted. In the scheme shown in Table 1, one arm is dedicated totaking unprocessed wafers from the upper loadlock and placing them inthe process module (arm 1), and the other dedicated to taking processedwafers from the process module and placing them in the lower loadlock(arm 2). In other embodiments, both arms may be used for processed andunprocessed wafers. In the scheme shown in Table 1, after the upperloadlock pick move, the arm 1 retracts and arm 2 is extended into thelower loadlock to place processed wafers there.

Lower LL Place: The transfer module robot extends arm 2—having a processwafer on each end effector—into the lower loadlock and places themthere. In certain embodiments, this is done simultaneously. Positioninformation of each wafer loadlock may be measured and stored for use bythe atmospheric robot in picking the wafers. The robot is thenpositioned for the process module pick move.

Process Module Pick: The transfer module robot extends arm 2 into theprocess module and picks the two processed wafers. In certainembodiments, this is done simultaneously. In the scheme shown in Table1, after the process module pick, the transfer module robot places theunprocessed wafers into the process module.

Process Module Place: The transfer module robot extends arm 1—having twounprocessed wafers—into the process module and places them at thestations (as in FIG. 4) either by lowering the wafers onto the stations,or by wafer supports in the stations lifting the wafers off the endeffectors. In certain embodiments, the place moves are done sequentiallyto allow position corrections to be made in each place move.

Examples of Timing of Various Transfer Module Robot Moves (Secs)

Goto incoming LL from outgoing LL: 1.2

Goto chamber 1 (process module) from LL and goto LL (90°): 1.8

Goto chamber 2 from LL and goto LL (180°): 2.8

Incoming LL “get” (pick): 4.3

Outgoing LL “put” (place): 4.3

Wafer Exchange (processed for unprocessed at process module or chamber):8.5

FIGS. 1-3 g and the associated discussion provide a broad overview ofthe dual wafer processing apparatus and methods discussed herein.Details of the transfer methods according to various embodiments havebeen omitted and are discussed in further detail below, including waferpick and place moves, wafer alignment, pressurization anddepressurization cycles, etc. Additional details of the apparatusaccording to various embodiments are also discussed below.

Stacked Loadlocks

In certain embodiments stacked independent loadlocks are provided. Thesemay be used in the dual wafer handling systems described. Single waferhandlers with multiple loadlocks can place loadlocks side-by-sideallowing the space above and below the loadlocks to be used forutilities and mechanisms. Dual wafer handlers classically use oneloadlock with multiple shelves. This limits the throughput of the systemas venting, cooling, pumping and robot exchanges must happen in seriesfor all incoming and outgoing wafers. The entire loadlock of a systemmust wait for multiple wafer exchanges at both vacuum and atmospherebefore the loadlock can move onto the next operation. For example, usinga single loadlock with multiple shelves, with having outbound wafersafter vent/cool:

1. Atmospheric doors open

2. Atmospheric robot picks two outbound wafers from loadlock

3. Atmospheric robot moves outbound wafers to storage cassette

4. Atmospheric robot places outbound wafers in storage cassette

5. Atmospheric robot picks two inbound wafers from storage cassette

6. Atmospheric robot moves inbound wafers to loadlock

7. Atmospheric robot places inbound wafers in loadlock

8. Atmospheric doors close and pumpdown

During the above sequence, the loadlock sits idle while the atmosphericrobot performs the wafer transfer steps 2-7. The loadlock also must sitidle during the wafer exchanges on the vacuum side. Multi-shelfloadlocks also expose incoming and outgoing wafers tocross-contamination during pumpdown and vent/cool. Some loadlock designsrequire indexers to move wafers up and down, adding complexity.

The wafer handling apparatuses according to certain embodiments includestacked independent loadlocks. Loadlocks 104 a and 104 b in FIGS. 3 a-eare stacked, independent loadlocks. By stacking independent loadlocksone on top of the other, the system operations (e.g., pumpdown,vent/cool, wafer exchanges) are decoupled, allowing various operationsto be performed in parallel, allowing throughput to be increased.

Because conventional loadlocks have utilities and mechanisms above andbelow the loadlock chamber, a large vertical space would be required tostack conventional independent loadlocks. This would require a largez-direction transfer module robot, as well large volumes of the transfermodule and the loadlocks. The stacked independent loadlocks designscompactly isolate upper and lower loadlocks and are configured forpumpdown and venting. According to various embodiments, the stackedindependent load locks have a small distance from each loadlock handoffplane, e.g., around 65 mm. This allows a transfer module robot arm (orboth transfer module robot arms if the are two) to reach both the upperand lower loadlocks.

According to various embodiments, the stacked loadlock assembliesdescribed herein have one or more of the following features:

Dual wafer capacity: the loadlock can hold dual wafer (side-by-side)capacity. Thus important for dual throughput, as two wafers go throughthe wafer handling and processing side-by-side. (See FIGS. 3 a-f).

Independent cycled stacked loadlocks: Upper and lower loadlocks areisolated from each other and are independently cycled as necessary(e.g., the upper loadlock is at vacuum conditions while the lower isatmospheric).

Compact design: The loadlock assembly is compactly designed, reducingheight as compared to conventional multi-loadlock systems. In addition,the distance between hand-off planes is small obviating the need forrobots with large z-direction freedom. Chamber volume may also be smallso that small pumps may be used. For example, with both chambers of aloadlock are combined, the upper and lower loadlock volumes may be fromabout 6.0-10 L. In one example, upper loadlock volume is 6.5 L and lowerloadlock volume is about 7.3 L.

Single center plate: The stacked chambers are separated by a singlecenter plate. In dual wafer capacity loadlocks, the left upper and lowerloadlock chambers are separated by a single plate, as are the rightupper and lower chambers. In certain embodiments, in addition toisolating the chambers, the single center plate may have additionalfunctionalities including providing annuluses for radial pumping andventing.

Optimized for unidirectional flow: A unidirectional loadlock handleswafers being transferred in one direction only—either inbound(atmospheric environment to transfer module) or outbound (transfermodule to atmospheric environment). The mechanical design of the inboundloadlock is optimized for pumpdowns and that of the outbound loadlockfor venting and cooling. In certain embodiments, the upper loadlock isoptimized for inbound wafers and lower chamber is optimized for outboundwafers.

Radial pumping and/or venting: The loadlock employs radial pumpingand/or venting to reduce particle contamination. In certain embodiments,the inbound loadlock pump flow vectors are radial and uniform emanatingfrom the center of the wafer. Similarly, the outbound loadlock vent flowvectors are radial and uniform emanating from the wafer center. Becausethe flows emanate from the wafer center, foreign material cannot betransported to the wafer from the other areas of the loadlock chamber.If used for unidirectional flow, particle contamination of the wafer isa concern only during pumpdown in the inbound loadlock and only duringventing in the outbound loadlock. In certain embodiments, the loadlockassemblies have annular recesses to facilitate radial pumping or ventingby choking the pumping or venting flow.

FIGS. 4 a and 4 b show an example of a loadlock assembly having stackedindependent loadlocks. In FIGS. 4 a and 4 b, the transfer module side ofthe loadlock assembly faces front. As described above, each loadlock hastwo connected chambers. Lids 114 each cover one chamber of the upperloadlock. Slit valves 120 show valves allowing access from the loadlockto the transfer module on the left side of the loadlocks. The valves onthe right side are not shown in the figure to provide a view of thehousing 450 and the loadlock assembly openings 452 in the housing 450.In certain embodiments, the slit valves may be independently controlledbut tied together pneumatically. Isolation manifold 454 leads to theloadlock pump is used for equalization and pumpdown operations. Sideports 456 allow viewing of the interior of the loadlock. Lower loadlocklift mechanism 458 is used to raise and lower the wafers from the coolplate to allow robot end effectors the clearance to pick and placewafers. This allows for a cool plate without large clearances cut forthe end effectors

The entire stacked independent loadlock assembly is compact—with aheight of about 5 inches for the chamber, with the valve actuators beingtaller the depicted embodiments Openings 452 are close enough togethersuch that a robot having a large z-direction freedom is not required.The wafer hand-off plane is the plane the robot picks or places thesubstrate from or into the loadlock. The distance between the upper andlower hand-off planes is important as it defines the minimum amount ofvertical freedom a robot arm that transfers wafers to or from both upperand lower loadlocks must have.

FIG. 5 a shows a cross-sectional view of a stacked loadlock assemblyaccording to certain embodiments. The upper loadlock has two chambers502 a and 502 b and the lower loadlock has two chambers 504 a and 504 b.A loadlock housing 505 provides a frame or support for the plates thatdefine the ceilings and floors of the loadlocks. The housing also hasopenings for wafer exit and entry. In the embodiment depicted in FIG. 5a, the housing also defines the sidewalls for both upper and lowerloadlocks and contains vent and pump channels for both loadlocks. Thehousing may be a single piece or multiple pieces. The upper loadlockchamber 502 a is separated from the lower loadlock chamber 504 a by acenter plate 506 a; loadlock chamber 502 b is separated from the lowerloadlock chamber 504 b by a center plate 506 b. In addition toseparating the upper and lower vacuum chambers, the center plate isdesigned for vacuum and atmospheric pressures on both sides with cyclingin both directions. In the embodiment depicted in FIG. 5 a, the stackedloadlocks have a single center plate separating each pair of stackedchambers (i.e., one center plate separating upper and lower chambers onthe right side and another center plate separating upper and lowerchambers on the left side). In addition to separating upper and lowerchambers, the center plate is also the wafer pedestal for the upperloadlock. FIG. 5 b shows an exploded view of an upper plate 514, centerplate 506, lower plate 516 and housing 505. The use of the single centerplate allows the distance between the wafer hand-off planes to besmall—in the embodiment depicted in FIG. 5 a, the distance betweenhand-off planes is about 65 mm.

In the embodiment depicted in FIG. 5 a, the center plate is a singleintegral removable plate configured to allow pumping and venting asdescribed below; however in other embodiments, multiple thin plates maybe used to isolate the upper and lower loadlocks. Upper plates or lids514 a and 514 b covers the upper chambers, and bottom plates 515 a and515 b form the floors of the lower chambers. Bottom plates 515 a and 515b may also have a cooling mechanism. Upper chambers 502 a and 502 b arein fluid communication are lower chambers 504 a and 504 b.

Channels 508 a and 508 b are vent channels for the upper loadlockchambers. Gases are introduced through inlet 512 and vented into theupper loadlock chambers through these channels. Channels 510 a and 510 bare pumpdown channels for the upper loadlock chambers. Gases are pumpedby the loadlock vacuum pump or pumps (not shown) and exit throughmanifold 514 to outlet 516. Pump and vent designs according to certainembodiments are described further below. The pump and vent channels forthe lower loadlock are behind the upper loadlock channels and are notshown in FIG. 5 a, but are described further below. FIG. 5 a also showslift mechanisms 518 and vacuum slit valves housing 520.

As indicated above, the stacked loadlock assemblies are compact. Thesize of the assemblies may be characterized by one or more of thefollowing: height (bottom of lower loadlock plate to top of upperloadlock plate); distance between upper and lower loadlock waferhand-off planes, center to center distance between upper and lowerloadlock openings, chamber volume, center to center distance betweenleft and right chambers, plate diameter bore, and total depth ofchamber. In the embodiment depicted in FIG. 5 a, the dimensions are asfollows:

Height: 6.2 inches

Distance between upper and loadlock hand-off planes: 65 mm

Center to center distance between upper and lower loadlock openings: 2.4inches

Chamber volume: 6.5 L upper loadlock (both chambers); 7.3 L lowerloadlock

Center to center distance between left and right chambers: 19 inches

Diameter bores for all plates: 13.2 inches

Total depth of chamber: 14.75 inches

According to various embodiments, these dimensions range as follows:

Height: about 4-10 inches

Distance between upper and lower loadlock hand-off planes: about 30mm-100 mm

Center to center distance between upper and lower loadlock openings:about 30 mm-100 mm

Chamber volume: about 3.0 L-20.0 L

Center to center distance between left and right chambers: about 12-30inches

Diameter bores for all plates: about 12-15 inches

Total depth of chamber: about 12-20 inches

In certain embodiments, one or more of the dual wafer loadlocks have nomoving parts. For example, in certain embodiments the incoming or upperload lock has no moving parts, only a shelf for the robots to set waferson, with clearance for the end effector below the shelf. In theembodiment depicted in FIG. 5 a, the lower loadlock does have a liftmechanism, which allows for better cooling performance. However,according to various embodiments, if cooling is done outside of theloadlock, either before or after moving through the outgoing loadlock orif no cooling is necessary, the outgoing loadlock would not need movingparts.

In certain embodiments, the wafer support in one or both of theloadlocks is a pair of shelves. A space under most of a wafer allows arobot arm to slide under to pick or place the wafer. The lift mechanismin the lower load lock creates this shelf for robot clearance while alsoallowing the wafer to be placed on the cool plate with small gaps to thewafer.

Annular Designs for Radial Uniform Top-Down Flow

Space above and below a loadlock is typically used for utilities andmechanisms in conventional loadlock systems—multiple independentloadlocks may be placed side-by-side, or require a robot having a largez-direction motion to pick up and place the wafers (or loadlocks thatare translated vertically). It is desirable for robots, and transfermodule robots, in particular not to be required to have largez-direction freedom.

Each loadlock requires mechanisms for pumping down (to lower thepressure before opening to the transfer module) and venting (to raisethe pressure before opening to the atmospheric environment). Rapidpumpdown can create high velocity turbulent flows through the loadlockchamber. If flow vectors are not carefully managed, foreign material maybe transported to the wafer surface during pumpdown. Similarly, ventingcan create high velocity turbulent flows that may transport particles tothe wafer surface. Conventional loadlocks often have a center pumpingport to pump down the loadlock chamber and/or a center venting port tovent the loadlock chamber. Conventional loadlocks may also use a ventdiffuser made of sintered metal on the chamber.

According to various embodiments, the loadlocks described herein eachhave venting and pumping ports and flow channels that permit a compactdesign. Notably, according to various embodiments, the designs do notrequire a center pumping/venting ports to ensure radial flows. Accordingto various embodiments, the loadlock assemblies have pumping annulusesfor providing uniform radial top-down flow during pumpdown and/orventing annuluses for providing uniform radial top-down flow duringvent. The flow vectors are managed such that the flow emanates uniformlyfrom the center of the wafer. Flow is also top down such that anyparticles are carried down and out of the chamber during pumpdown. FIGS.6 a-7 b show the pump and vent designs for a stacked loadlock assemblyas shown in FIGS. 4 a-5 a, with FIGS. 6 a and 6 b showing the pump andvent designs for the upper loadlock and FIGS. 7 a and 7 b showing thepump and vent designs for the lower loadlock.

FIGS. 6 a and 6 b illustrate a pump annulus design for a loadlock. Inthe embodiment depicted in FIGS. 6 a and 6 b, the pump annulus design isfor an upper loadlock. As described above, an upper loadlock chamber 602is separated from a lower loadlock chamber 604 by center plate 606.During pumpdown, gases are pumped through annular gap 664 (also referredto as an annular channel) around the outside edge of the wafer position(in this case between center plate 606 and the loadlock housing 605).Below the gap an annular chamber 660 and exit port 610 are also shown,with the annular chamber 660 extending around the chamber. The annularchamber is formed by an annular recess in the center plate 606. Exitport 610 leads to a manifold below the stacked assembly. The gap 664between center plate 606 and the loadlock housing 605 leading to thepump annulus and exit port is tight. By pumping through this tight gap,flow conductance is choked to force even pumping at all radial pointsaround the wafer. The dotted arrows show the flow path extendingradially outward from the center of the wafer to the annulus, and thendown the exit port. (The lower loadlock flow channels discussed below inFIGS. 7 a and 7 b are not visible in FIG. 6 a).

FIG. 6 b shows a close-up view of the pumping annular gap and annularchamber, including upper loadlock chamber 602, center plate 606, annulargap or channel 664 and annular chamber 660. O-ring 676 is also shown.The height and width of the annular gap are uniform around the annulusand optimized. The exact dimensions of the annular gap depend on factorsincluding the flow rate, chamber volume, chamber diameter, etc. In theembodiment depicted in FIG. 6 b, the width is about 0.03 inches and theheight about 0.25 inches. The use of the tight annular gap to choke theflow forces the flow to be radial. The annular chamber below the gapprovides a buffer for maintaining a uniform and even flow. In particularembodiments, the annular gap is below the wafer surface so that thepumpdown flow is top to bottom to enhance particle control.

The width of the tight annular gap is small enough to force the flow tobe uniform and radial, while keeping the pressure drop across the gap tobe within manufacturing tolerances. If the gap is too large, all of thegas flows down on the side closest to the pump port. Very small gaps,e.g., on the order of 5-10 mils, may create pressure drops that may behard to manage. In certain embodiments, the gap is sized so that flow isradial and moves downward everywhere reducing or minimizing particlerisk, if not small enough to be perfectly uniform.

Returning to FIG. 6 a, annular chamber 668 in upper plate 614 is usedfor venting the upper loadlock—gases from inlet port 608 go from annularchamber 668 through the annular gap 674 and into the upper loadlockchamber 602. The annular chamber and annular gap promote radial venting.The annular gap chokes the flow, causing gases to go through the annularchamber and vent into the chamber radially. In an inbound only loadlock(as used in unidirectional flow), radial venting is not as critical asradial pumping as there is no wafer in the loadlock during the venting,though may still be advantageous to provide a uniform flow curtain towater vapor when the ATM door is open. During vent, there is no wafer inthe incoming loadlock, hence there is less of a need for flow control.However, when the incoming loadlock ATM door opens, a flow of gas isturned on to the loadlock that creates a curtain at the door to preventair from coming in. The air in the mini-environment is relatively clean,but contains oxygen, water and other constituents that may beundesirable in the loadlock (during pumpdown), transfer module, andprocess chamber. By providing a curtain of clean inert gas such asnitrogen or argon, the majority of unwanted gasses are preventing fromentering the loadlock. Because the wafer is passed through this curtainwhen the ATM robot places a wafer in the loadlock, managing the flowvectors as of this curtain as described means that a jet of gas flow isnot directly pointed at the wafer. In other embodiments, the inboundloadlock vent flow is not radial.

The annular gap width ranges from about 0.005-0.050 inches in certainembodiments. The rectangular cross section of the annular chamber mayhave dimensions of between about 0.25-1.5 inches in certain embodiments.For example, in a particular embodiment, the annular chamber has arectangular cross-section of 1.5×0.5 inches.

FIGS. 7 a and 7 b illustrate a vent diffuser design for a loadlock,specifically for a lower loadlock in the embodiment depicted in FIGS. 7a and 7 b. Upper loadlock chamber 702 is separated from lower loadlockchamber 704 by center plate 706. The center plate 706 contains theannular recess described above for pumping down the upper loadlockchamber 702. A gas supply port 711 is located on the side of theloadlock. Gases are vented through an annular chamber 784 and thenintroduced to lower loadlock chamber 704 through a gap 786 (alsoreferred to as an annular channel) located around the ceiling of theloadlock chamber. The geometry of this gap introduces flow vectors fromthe ceiling and toward the center of the wafer, where they curvedownward toward the top surface of the wafer. These flow vectors areindicated in the figure by the dotted lines. By venting through thetight gap, flow conductance is choked to force even venting at allradial points around the top of the wafer. The flows emanate from thetop of the wafer, pushing particles or other foreign material away fromthe wafer and preventing foreign material from being transported to thewafer from other areas of the loadlock chamber. (The upper loadlockinlet and exit ports discussed above are not visible in FIG. 7 a).

A close-up view of the gap and annular chamber is shown in FIG. 7 b,with the dotted arrows indicating the flow vectors. Vent gases enterfrom the supply or inlet port 711 and directed through channel 713 tothe annular chamber 784. The gases are then introduced to loadlockthrough the annular gap 786. The gap is stepped so that flow enters thechamber parallel to the wafer, with the resulting flow vectors shown inFIG. 7 a. Because the tight gap chokes the flow, filling annular chamber784 with the vent gases, the gases are introduced radially and uniformlyover the wafer. The gap may extend over the wafer such that the entrypoint of the gas into the chamber is between the edge and center of thewafer. In one example the entry point is at about 8 inches (˜200 mm)diameter for a 300 mm wafer.

In the embodiment depicted in FIG. 7 b, the lower loadlock is optimizedfor outbound wafers in unidirectional flow. The lower loadlock is pumpeddown from the side at exit port 780—because the loadlock is optimizedfor outbound wafers, wafers are typically not present during thepumpdown operation and so the flow vectors are not critical to managingcontamination.

In the stacked loadlock assemblies depicted in the above figures, asingle center plate as discussed above is used to separate the upper andlower chambers. This plate also creates the annular volumes for theupper loadlock pumping annulus and the lower loadlock venting annulus.The center plate also creates the gaps for the pumpdown flow choking andacts as the vent gas flow choke path and mechanical diffuser.

The annular designs for uniform radial flow during pumpdown and venthave been described above in the context of a stacked loadlock assemblywith the upper loadlock optimized for inbound wafers and the lowerloadlock optimized for outbound wafers. According to variousembodiments, the annular designs for vent and/or pumpdown are used inother types of loadlock assemblies. For example, a single stacked orunstacked loadlock may have two annular gaps and chambers to manage flowvectors during both pump and vent (one such embodiment is shown above inFIG. 6 a, which has a pump and a vent annulus.) One of skill in the artwill also understand from the above description how to optimize an upperloadlock of a stacked loadlock assembly for outbound wafers and a lowerloadlock for inbound wafers.

To create top-down flows to push particles away from the wafers, theannular gap is typically below the wafer support for pumpdown and theannular gap is typically above the wafer support for vent. However, incertain embodiments, the annular gaps may be otherwise placed (e.g., dueto other design considerations). In another example, in certainembodiments, a loadlock may have an annular gap and chamber for pumpdowncombined with a central port for the other operation. The designs may beused with both unidirectional and bidirectional loadlocks.

In the figures above, the annular gaps are defined by a plate and theloadlock housing or sidewall: the upper loadlock pump gap 664 in FIGS. 6a and b is defined by the center plate and the housing or sidewall, thelower loadlock vent gap 786 in FIGS. 7 a and 7 b is also defined by thecenter plate and a sidewall, and the upper loadlock vent gap 674 in FIG.6 a is defined by the upper plate and the housing or sidewall. Theannular chambers are formed by annular recesses in the center or upperplate. According to various embodiments, the annular gaps and chambersmay be formed by any appropriate structure, e.g., an annular recess inthe loadlock housing, that may be used to form a flow path as describedabove. Any structure that chokes the flow through an annular gap may beused.

The annular gap (annular channel width) ranges from about 005-0.050inches in certain embodiments. The rectangular cross section of theannular chamber may have dimensions of between about 0.25-1.5 inches incertain embodiments. For example, in a particular embodiment, theannular chamber has a rectangular cross-section of 0.5×0.5 inches.

1. A stacked loadlock assembly comprising: a upper loadlock comprisingone or more substrate chambers; a lower loadlock comprising one or moresubstrate chambers; each upper loadlock substrate chamber disposed overa lower loadlock substrate chamber; and one or more center plates forisolating each lower loadlock substrate chamber from the overlying upperloadlock substrate chamber, wherein each center plate defines the floorof the overlying upper loadlock substrate chamber and the ceiling of theunderlying lower loadlock substrate chamber, and wherein each centerplate comprises first and second annular recesses, the first annularrecess at least partially defining a flow path for pumping gas out ofthe overlying upper loadlock substrate chamber and the second annularrecess at least partially defining a flow path for venting gas into theunderlying lower loadlock substrate chamber.
 2. The stacked loadlockassembly of claim 1 further comprising at least one upper aperature fortransferring substrates in and/or out of the upper loadlock and at leastone lower aperature for transferring substrates in and/or out of thelower loadlock, wherein the at least one upper aperature is separatedfrom the at least one lower aperature by a vertical distance of no morethan about 100 mm.
 3. The stacked loadlock assembly of claim 1 whereinthe height of the assembly is no more than 10″ chamber height.
 4. Thestacked loadlock assembly of claim 1, further comprising a substratesupport in a substrate chamber, a side inlet port, said side inlet portopening into annular chamber located above said substrate chamber, saidannular chamber connected to an annular stepped channel for directingflow parallel the substrate support.
 5. The stacked loadlock assembly ofclaim 4 further comprising a loadlock housing defining the side inletport.
 6. The stacked loadlock assembly of claim 4 further comprising aloadlock housing, wherein the annular stepped channel is defined by theloadlock housing and a recessed portion of the center plate.
 7. Thestacked loadlock assembly of claim 6, wherein annular sections of thecenter plate and loadlock housing are stepped, the outer diameter of thestepped section of the center plate less than the inner diameter of thestepped section of the loadlock housing to thereby define the annularstepped channel.
 8. The stacked loadlock assembly of claim 4 wherein thewidth of the annular stepped channel is between about 0.005 to 0.050inches.
 9. The stacked loadlock assembly of claim 4 wherein the annularstepped channel comprises an outer section parallel to a substratesupport surface, a perpendicular section, and an inner parallel section.10. The stacked loadlock assembly of claim 4 wherein the dimensions of arectangular cross-section of the annular chamber range from about 0.25inches to about 1.5 inches.
 11. The stacked loadlock assembly of claim 4wherein the side inlet port, the annular chamber and annular steppedchannel define a flow path for gases vented into the loadlock chamber.12. The stacked loadlock assembly of claim 11 wherein the annularstepped channel is operable to choke the vent gas flow.
 13. The stackedloadlock assembly of claim 1, further comprising a substrate support ina substrate chamber, a side outlet port opening into an annular chamber,the annular chamber located below said wafer support; a narrow annularchannel connecting the substrate chamber to the annular chamber fordirecting flow into the annular chamber, wherein the inner diameter ofthe narrow annular channel is greater than the outer diameter of thesubstrate support.
 14. The stacked loadlock assembly of claim 13 furthercomprising a loadlock housing defining the side outlet port.
 15. Thestacked loadlock assembly of claim 13 further comprising a loadlockhousing, wherein the narrow annular channel is defined by the loadlockhousing and portion of the center plate.
 16. The stacked loadlockassembly of claim 15 wherein the outer diameter of a section of thecenter plate is less than the inner diameter of a section of theloadlock housing to thereby define the narrow annular channel.
 17. Thestacked loadlock assembly of claim 13 wherein the width of the narrowannular channel is between about 0.005 to 0.050 inches.
 18. The stackedloadlock assembly of claim 13 wherein dimensions of a rectangularcross-section of the annular chamber range from about 0.25-1.5 inches.19. The stacked loadlock assembly of claim 1, further comprising: alower loadlock substrate support in a substrate chamber of said lowerloadlock; a side inlet port, said side inlet port opening into a firstannular chamber located above the substrate chamber of said lowerloadlock; said first annular chamber connected to an annular steppednarrow channel for directing flow parallel to the lower loadlocksubstrate support; an upper loadlock wafer support in a substratechamber of said upper loadlock; a side outlet port opening into a secondannular chamber located below said upper loadlock substrate support; anda narrow annular channel connecting the substrate chamber of the upperloadlock to the second annular chamber for directing flow into thesecond annular chamber, the inner diameter of the narrow annular channelgreater than the upper loadlock substrate support diameter.
 20. Thestacked loadlock assembly of claim 1 further comprising one or moreupper loadlock lids for covering the one or more upper loadlocksubstrate chambers, wherein each lid comprises an annular recess that atleast partially defines a flow path for venting gas into an upperloadlock substrate chamber.